Chinese chipmaker Montage Technology has unveiled new data center processors under its Jintide brand based on Intel's latest Emerald Rapids Xeon architecture. The 5th generation Jintide lineup offers anywhere from 16-core to 48-core options for enterprise customers needing advanced security specific to China's government and enterprise requirements. Leveraging a long-running joint venture with Intel, Jintide combines standard high-performance Xeon microarchitectures with added on-die monitoring and encryption blocks, PrC (Pre-check) and DSC (Dynamic Security Check), which are security-hardened for sensitive Chinese use cases. The processors retain all core performance attributes of Intel's vanilla offerings thanks to IP access, only with extra protections mandated by national security interests. While missing the very highest core counts, the new Jintide chips otherwise deliver similar Emerald Rapids features like 8-channel DDR5-5600 memory, 80 lanes of speedy PCIe 5.0, and elevated clock speeds over 4.0 GHz at peak. The Jintide processors have 2S scaling, which allows for dual-socket systems with up to 96 cores and 192 threads.

Pricing remains unpublished but likely carries a premium over Intel list prices thanks to the localized security customization required. However, with Jintide uniquely meeting strict Chinese government and data regulations, cost becomes secondary for target customers needing compliant data center hardware. After matching lockstep with Intel's last several leading Xeon generations, Jintide's continued iteration highlights its strategic value in enabling high-performance domestic infrastructure as China eyes IT supply chain autonomy. Intel gets expanded access to the growing Chinese server market, while Chinese partners utilize Intel IP to strengthen localized offerings without foreign dependency. It manifests the delicate balance of advanced chip joint ventures between global tech giants and rising challengers. More details about the SKUs are listed in the table below.

Intel is slowly preparing to launch its next-generation Meteor Lake mobile processor family, dropping the Core i brand name in favor of Core Ultra. Today, we are witnessing some early Geekbench v6 benchmarks with the latest leak of the Core Ultra 7 155H processor, boasting an integrated Arc GPU featuring 8 Xe-Cores—the complete configuration expected in the GPU tile. This tile is also projected to be a part of the more potent Core 9 Ultra 185H CPU. The Intel Core Ultra 7 155H processor has been benchmarked in the new ASUS Zenbook 14, which houses a 16-core and 22-thread hybrid CPU configuration capable of boosting up to 4.8 GHz. Paired with 32 GB of memory, the configuration was well equipped to supply CPU and GPU with sufficient memory space.

Perhaps the most interesting information from the submission was the OpenCL score of the GPU. Clocking in at 33948 points in Geekbench v6, the GPU is running over AMD's Radeon 780M GPU found in APU solutions like AMD Ryzen 9 7940HS and Ryzen 9 7940U, which scored 30585 and 27345 points in the same benchmark, respectively. The GPU tile is millimeters away from closing the gap between itself and the desktop Intel Arc A380 discrete GPU, which scored 37105 points for less than a 10% difference. The Xe-LPG GPU version is bringing some interesting performance points for the integrated GPU platform, which means that Intel's Meteor Lake SKUs will bring more performance/watt than ever.

Intel's upcoming Meteor Lake processor family will see the light of the day in mobile version only, with a big re-brand of the Intel Core i naming structure. Slated for a December 14th launch, we are eager to see the official performance figures. However, we are in for a treat today as we have some early performance figures thanks to Geekbench. According to the GB5 run found by BenchLeaks, Intel's Core Ultra 9 185H CPU has appeared to show its configuration, early performance, and boost frequency that is reaching beyond the 5.0 GHz mark.

As the GB5 run suggests, Core Ultra 9 185H is a 16-core CPU with 22 threads, running at 2.5 GHz base frequency. There are six P-cores, eight E-cores, and two SoC-cores on the package of this SKU. During boost, the CPU can reach up to 5.1 GHz and was paired with 64 GB of DDR5 memory. Interestingly, the CPU scored 1849 points in single-threaded tests and 9832 points in multi-threaded tests, which currently doesn't beat top-end Intel mobile HX SKU like i9-13980HX. However, we estimate this was an early engineering sample, and the final product will be more performant.

Apple today announced iPhone 15 and iPhone 15 Plus, featuring an industry-first color-infused back glass with a stunning, textured matte finish, and a new contoured edge on the aluminium enclosure. Both models feature the Dynamic Island, and an advanced camera system designed to help users take fantastic photos of everyday moments in their lives. A powerful 48MP Main camera enables super-high-resolution photos and a new 2x Telephoto option to give users a total of three optical zoom levels—like having a third camera. The iPhone 15 lineup also introduces the next generation of portraits, making it easier to capture portraits with great detail and low-light performance. Building on Apple's innovative satellite infrastructure, Roadside Assistance via satellite can connect users to AAA if they have car trouble while off the grid. With A16 Bionic for powerful, proven performance; a USB‑C connector; Precision Finding for Find My friends; and industry-leading durability features, iPhone 15 and iPhone 15 Plus represent a huge leap forward.

iPhone 15 and iPhone 15 Plus will be available in five stunning new colors: pink, yellow, green, blue, and black. Pre-orders begin Friday, September 15, with availability beginning Friday, September 22.

During its "Xiamen HighFun" event in China, Minisforum announced the latest addition to its compact series of gaming PCs, this time with no official name. The 6-liter system, code-named "Project RPFXI" for Intel and "Project DRFXI" for AMD, will support up to 100 W TDP and utilize the most powerful Ryzen CPU, the Ryzen 9 7945HX3D. This hybrid mobile/desktop processor combines the desktop-level performance of 16 Zen 4 cores with 144 MB of 3D V-cache, all within a 55 W power limit. Minisforum confirmed the 7945HX3D would be available in the AMD platform version, positioned as a premium model compared to the existing 7945HX system.

Interestingly, the GPU support is literally external, as the potential GPU needs to be attached to the outside part of the case, which is then secured using screws. The case could accommodate the fastest GPUs like NVIDIA GeForce RTX 4090 with a powerful enough power supply. The 6-liter mini PC is expected to launch in late 2023, either in 24-core Intel (HX line) configuration, of 16-core AMD configuration.

Amid the push for technology independence, Chinese companies are pushing out more products to satisfy the need for the rapidly soaring demand for domestic data processing silicon. Today, we have information that Chinese Loongson has launched a 3D5000 CPU with as many as 32 cores. Utilizing chiplet technology, the 3D5000 represents a combination of two 16-core 3C5000 processors based on LA464 cores, based on LoongArch ISA that follows the combination of RISC and MIPS ISA design principles. The new chip features 64 MB of L3 cache, supports eight-channel DDR4-3200 ECC memory achieving 50 GB/s, and has five HyperTransport (HT) 3.0 interfaces. The TDP configuration of the chip is officially 300 Watts; however, normal operation is usually at around 150 Watts, with LA464 cores running at 2 GHz.

Scaling of the new chip goes beyond the chiplet, and pours over into system, as 3D5000 supports 2P and 4P configurations, where a single motherboard can become a system of up to 128 cores. To connect them, Loongson uses a 7A2000 bridge chip that is reportedly 400% faster than the previous solution, although we have no information about the last chip bridge. Based on the LGA-4129 package, the chip size is 75.4x58.5×6.5 mm. Regarding performance, Loongson compares it to the average Arm chip that goes into smartphones and claims that its designs are up to four times faster. In SPEC2006, performance reaches 425 points, while maintaining a single TeraFLOP at dual-precision 64-bit format. On the other hand, the processor was built for security, as the chip has a custom hardware-baked security to prevent Spectre and Meltdown, has an on-package Trusted Platform Module (TPM), and has a secret China-made security algorithm with an embedded custom security module that does encryption and decryption at 5 Gbps.

QNAP Systems, Inc., a leading computing, networking, and storage solution innovator, today launched new high-performance TVS-h874 QuTS hero NAS models that incorporate 12th Gen Intel Core i9 sixteen-core, i7 twelve-core multi-thread processors with Intel Core Hybrid Technology for optimal computing performance and smooth multiple virtual machine (VM) operation. Integrating the reliable ZFS-based operating system, PCIe Gen 4 expandability, M.2 NVMe SSD caching, and 2.5GbE/10GbE connectivity, the TVS-h874 assists businesses in building high-performance storage environments for hosting multiple VM, application servers, and running business data backup/restore applications.

"The new TVS-h874 models adopt Intel Core Hybrid Technology, combining Performance-cores and Efficient-cores," said Andy Chuang, Product Manager of QNAP, adding "The Performance Hybrid Architecture intelligently allocates CPU cores to different tasks, thus increasing the performance of the new TVS-h874 models by 3.55 times compared with previous models."

AMD today announced its new Ryzen 7000X3D high-end desktop processors to much fanfare, with availability slated for February 2023, you can read all about them in our older article. In our coverage, we noticed something odd about the cache sizes of the 12-core 7900X3D and 16-core 7950X3D. Whereas the 8-core, single-CCD 7800X3D comes with 104 MB of total cache (L2+L3), which works out to 1 MB L2 cache per core and 96 MB of L3 cache (32 MB on-die + 64 MB stacked 3DV cache); the dual-CCD 7900X3D and 7950X3D was shown with total caches of 140 MB and 144 MB, while they should have been 204 MB or 208 MB, respectively.

In our older article, we explored two possibilities—one that the 3DV cache is available on both CCDs but halved in size for whatever reason; and the second more outlandish possibility that only one of the two CCDs has stacked 3DV cache, while the other is a normal planar CCD with just the on-die 32 MB L3 cache. As it turns out, the latter theory is right! AMD put out high-resolution renders of the dual-CCD 7000X3D processors, where only one of the two CCDs is shown having the L3D (L3 cache die) stacked on top. Even real-world pictures of the older "Zen 3" 3DV cache CCDs from the 5800X3D or EPYC "Milan-X" processors show CCDs with 3DV caches having a distinct appearance with dividing lines between the L3D and the structural substrates over the regions of the CCD that have the CPU cores. In these renders, we see these lines drawn on only one of the two CCDs.

AMD today solved the biggest challenge affecting its mobile processor family against Intel—CPU core-counts in the high-end HX-segment, with the introduction of the new Ryzen 7045HX series "Dragon Range" mobile processors. Based on the "Zen 4" microarchitecture, these processors offer core-counts of up to 16-core/32-thread, and target enthusiast gaming notebooks and mobile workstations. The processors debut the new "Dragon Range" multi-chip module (MCM). This is essentially a non-socketed version of the desktop "Raphael" MCM built in a mobile-friendly BGA package with a thin substrate and no IHS, with up to two 5 nm "Zen 4" 8-core CCDs, and a 6 nm cIOD (client I/O die).

The "Dragon Range" MCM uses the same chiplets as desktop "Raphael" Ryzen 7000 processors, and so its I/O is similar. The cIOD puts out a dual-channel (4 sub-channel) DDR5 memory interface, and a PCI-Express 5.0 x16 interface for discrete graphics, along with two PCI-Express 5.0 x4 links for up to two Gen 5 NVMe SSDs. The platform core-logic (chipset) is functionally similar to the desktop AMD B650E. All processor models in the series come with a TDP of 45 W, and a package power tracking (PPT) of "at least" 75 W. Each "Zen 4" CPU core comes with 1 MB of dedicated L2 cache, and each CCD has 32 MB of L3 cache.

Chinese processor designers need help creating a leading-edge design that satisfies their needs, with the imposed sanctions and restrictions of Western countries. However, designers are using creative ways to make a server processor to fulfill their needs. According to the latest Sina report, Chinese company Loongson has developed a 32-core processor using chiplet technology. Previously, the company announced its 16-core 3C5000 processor based on LA464 cores, which utilize LoongArch ISA. Loongson used chiplet technology to fuse two 3C5000 processors into a single-socket solution called 3D5000, which features 32 LA464 cores to create a higher-performing design. Based on the LGA-4129 package, the chip size is 75.4x58.5×6.5 mm.

The company claims that the typical power consumption is rated for 130 Watts at 2.0 GHz or 170 Watts at 2.2 GHz, with TDP power consumption not exceeding 300 Watts at 2.2 GHz even with peaks. The performance of the new 3D5000 processor, measured using SPEC2006, is 400 points and 800 points for single-socket and dual-socket servers, respectively. The four-socket server is expected to reach 1600 points in the same benchmark, so scaling is advertised as linear. Loongson hopes to provide samples to industry partners in the first half of 2023 with an unknown price tag.

AMD, in its technical presentation for the new Radeon RX 7900 series "Navi 31" GPU, gave us an elaborate explanation on why it had to take the chiplets route for high-end GPUs, devices that are far more complex than CPUs. The company also enlightened us on what sets chiplet-based packages apart from classic multi-chip modules (MCMs). An MCM is a package that consists of multiple independent devices sharing a fiberglass substrate.

An example of an MCM would be a mobile Intel Core processor, in which the CPU die and the PCH die share a substrate. Here, the CPU and the PCH are independent pieces of silicon that can otherwise exist on their own packages (as they do on the desktop platform), but have been paired together on a single substrate to minimize PCB footprint, which is precious on a mobile platform. A chiplet-based device is one where a substrate is made up of multiple dies that cannot otherwise independently exist on their own packages without an impact on inter-die bandwidth or latency. They are essentially what should have been components on a monolithic die, but disintegrated into separate dies built on different semiconductor foundry nodes, with a purely cost-driven motive.

Apple today introduced the new iPad with an all-screen design featuring a large 10.9-inch Liquid Retina display. The new iPad is powered by the A14 Bionic chip, which delivers even faster performance with incredible power efficiency for demanding tasks while still providing all-day battery life. Updated cameras include an Ultra Wide 12MP front camera located along the landscape edge of iPad for an even better video calling experience, and an updated 12MP back camera to capture sharp, vivid photos and 4K video. A USB-C port supports a wide range of accessories, Wi-Fi 6 brings even faster connections, and cellular models feature superfast 5G so users can stay connected on the go. Designed specifically for the new iPad, the all-new Magic Keyboard Folio features an incredible typing experience, a click-anywhere trackpad, and a versatile two-piece design. With iPadOS 16 and support for Apple Pencil (1st generation), iPad offers users more ways to be creative and productive. The new iPad is available to order starting today, with availability in stores beginning Wednesday, October 26.

"We're so excited to bring the completely redesigned iPad to our most advanced iPad lineup ever," said Greg Joswiak, Apple's senior vice president of Worldwide Marketing. "With a large 10.9-inch Liquid Retina display, powerful A14 Bionic chip, a first-ever landscape front camera, fast wireless connectivity, USB-C, and support for incredible accessories like the new Magic Keyboard Folio, the new iPad delivers more value, more versatility—and is simply more fun."

Apple today announced the new iPad Pro with the M2 chip, delivering the ultimate combination of portability, versatility, and unbelievable performance. The new iPad Pro features a next-level Apple Pencil hover experience and superfast wireless connectivity, along with the world's most advanced mobile display, pro cameras, Face ID, Thunderbolt, and a four-speaker audio system. New features in iPadOS 16—including Stage Manager, full external display support, desktop-class apps, and Reference Mode—take pro workflows on iPad even further. Enabled by its advanced hardware and iPadOS 16, iPad Pro has an incredible ecosystem of powerful pro apps unlike any other device of its kind. The new iPad Pro is available to order starting today, and in stores beginning Wednesday, October 26.

"The next-generation iPad Pro pushes the boundaries of what's possible on iPad, bringing even more versatility, power, and portability to the ultimate iPad experience," said Greg Joswiak, Apple's senior vice president of Worldwide Marketing. "Powered by the M2 chip, the new iPad Pro features incredible performance and the most advanced technologies, including a next-level Apple Pencil hover experience, ProRes video capture, superfast wireless connectivity, and powerful iPadOS 16 features. There's nothing else like it."

AMD Ryzen 9 7950X 16-core processor exhibits some strange behavior with regards to the max boost frequency spread among its cores. A multi-chip module with two 8-core CCDs (CPU complex dies); we noticed early on in our review that the cores located in CCD-1 boost to a higher frequency than the ones in CCD-2, with differences as high as 300 MHz. CapFrameX noticed that when CCD-2 is disabled on a machine running Windows 11 22H2, the processor actually puts out higher gaming performance, by as much as 10%. This is mainly because the cores in CCD-2, with a lower maximum boost frequency no longer handle processing load from the game; and with CCD-2 disabled, CCD-1 has all of the processor's power budget—up to 230 W—to itself, giving it much higher boost residency across its 8 cores.

Apple today announced iPhone 14 Pro and iPhone 14 Pro Max, the most advanced Pro lineup ever, featuring the Dynamic Island—a new design that introduces an intuitive way to experience iPhone—and the Always-On display. Powered by A16 Bionic, the fastest chip ever in a smartphone, iPhone 14 Pro introduces a new class of pro camera system, with the first-ever 48MP Main camera on iPhone featuring a quad-pixel sensor, and Photonic Engine, an enhanced image pipeline that dramatically improves low-light photos. These groundbreaking advancements make iPhone even more indispensable for everyday tasks, creative projects, and now even emergency situations with features such as Emergency SOS via satellite and Crash Detection. iPhone 14 Pro and iPhone 14 Pro Max will be available in four gorgeous new finishes: deep purple, silver, gold, and space black. Pre-orders begin Friday, September 9, with availability beginning Friday, September 16.

"Our customers count on their iPhone every day, and with iPhone 14 Pro and iPhone 14 Pro Max, we're delivering more advancements than any other iPhone. iPhone 14 Pro introduces a camera system that empowers every user—from the casual user to the professional—to take their best photos and video, and innovative new technologies like the Always-On display and the Dynamic Island, which offers new interactions for notifications and activities," said Greg Joswiak, Apple's senior vice president of Worldwide Marketing. "Groundbreaking safety capabilities bring users even more security, offering help when they need it most. And with the incredibly powerful and efficient A16 Bionic chip and all-day battery life, this is the best iPhone yet."

QNAP Systems, Inc., today launched the TS-h1290FX NAS. Providing QNAP's first PCIe 4.0 and U.2 NVMe/SATA all-flash NAS in a tower form factor, the TS-h1290FX excels in the most demanding work environments such as collaborative high-resolution video workflows. Featuring AMD EPYC 8/16-core processors, built-in 25GbE and 2.5GbE connectivity, PCIe Gen 4 expansion, and up to petabyte-scale storage capacity, the TS-h1290FX tackles data-intensive and latency-sensitive applications, such as large media file transfer, real-time editing of 4K/8K high-resolution media, online collaborative workflows, and virtualization applications.

"Modern businesses and studios shouldn't need to dedicate entire rooms to accommodate hot and loud servers, and that's where the TS-h1290FX comes in. Contained within a unique tower form factor and utilizing quiet cooling is exceptional performance driven by a server-grade processor, all-flash U.2 NVMe SSD storage, and QNAP's enterprise-grade QuTS hero operating system," said Jason Hsu, Product Manager of QNAP.

As we approach the launch of Intel's upcoming Raptor Lake desktop processors, we are getting more leaks of testing performed by system integrators and 3rd parties that have early access to the engineering sample (ES) chips. A few days ago, we saw an Intel Core i7-13700K CPU run Geekbench 5 benchmark with the older DDR4 memory on ASRock Z690 Steel Legend WiFi 6E. Today, we are seeing a similar test performed on the same processor, with ASRock Z690 Steel Legend WiFi 6E/D5 equipped with DDR5 memory. While the previous DDR4 testing used modules running at 3200 MT/s, the DDR5 testing uses 5200 MT/s rated DRAM with unknown timings and setup.

As far as performance goes, the single-core result of the 16-core Intel Core i7-13700K processor was 2090 points with DDR4, while DDR5 showed a slight regression of 2069 points. Of course, this could be attributed to the margin of error. As far as multi-core performance goes, the DDR4 testing managed to produce 16542 points, whereas the DDR5-equipped platform scored 19811 points. This is an immediate 20% performance uplift in multi-core score. It shows that all the cores present in Raptor Lake processors are starving for bandwidth, and a faster memory protocol can bring quite an improvement. As usual, we have to wait to confirm this information with our testing so that we can draw more conclusions.

AMD is preparing to update its mobile sector with the latest IP in the form of Zen4 CPU cores and RDNA3 graphics. According to Red Gaming Tech, we have specifications of upcoming processor families. First, we have AMD Dragon Range mobile processors representing a downsized Raphael design for laptops. Carrying Zen4 CPU cores and RDNA2 integrated graphics, these processors are meant to power high-performance laptops with up to 16 cores and 32 threads. Being a direct competitor to Intel's Alder Lake-HX, these processors also carry an interesting naming convention. The available SKUs include AMD Ryzen 5 7600HX, Ryzen 7 7800HX, Ryzen 9 7900HX, and Ryzen 9 7980HX design with a massive 16-core configuration. These CPUs are envisioned to run along with more powerful dedicated graphics, with clock speeds of 4.8-5.0+ GHz.

Next, we have AMD Phoenix processors, which take Dragon Range's design to a higher level thanks to the newer graphics IP. Having Zen4 cores, Phoenix processors carry upgraded RDNA3 graphics chips to provide a performance level similar to NVIDIA's GeForce RTX 3060 Max-Q SKU, all in one package. These APUs will come in four initial configurations: Ryzen 5 7600HS, Ryzen 7 7800HS, Ryzen 9 7900HS, and Ryzen 9 7980HS. While maxing out at eight cores, these APUs will compensate with additional GPU compute units with a modular chiplet design. AMD Phoenix is set to become AMD's first chiplet design launching for the laptop market, and we can expect more details as we approach the launch date.

AMD today unveiled its next-generation Ryzen 7000 desktop processors, based on the Socket AM5 desktop platform. The new Ryzen 7000 series processors introduce the new "Zen 4" microarchitecture, with the company claiming a 15% single-threaded uplift over "Zen 3" (16-core/32-thread Zen 4 processor prototype compared to a Ryzen 9 5950X). Other key specs about the architecture put out by AMD include a doubling in per-core L2 cache to 1 MB, up from 512 KB on all older versions of "Zen." The Ryzen 7000 desktop CPUs will boost to frequencies above 5.5 GHz. Based on the way AMD has worded their claims, it seems that the "+15%" number includes IPC gains, plus gains from higher clocks, plus what the DDR4 to DDR5 transition achieves. With Zen 4, AMD is introducing a new instruction set for AI compute acceleration. The transition to the LGA1718 Socket AM5 allows AMD to use next-generation I/O, including DDR5 memory, and PCI-Express Gen 5, both for the graphics card, and the M.2 NVMe slot attached to the CPU socket.

Much like Ryzen 3000 "Matisse," and Ryzen 5000 "Vermeer," the Ryzen 7000 "Raphael" desktop processor is a multi-chip module with up to two "Zen 4" CCDs (CPU core dies), and one I/O controller die. The CCDs are built on the 5 nm silicon fabrication process, while the I/O die is built on the 6 nm process, a significant upgrade from previous-generation I/O dies that were built on 12 nm. The leap to 5 nm for the CCD enables AMD to cram up to 16 "Zen 4" cores per socket, all of which are "performance" cores. The "Zen 4" CPU core is larger, on account of more number-crunching machinery to achieve the IPC increase and new instruction-sets, as well as the larger per-core L2 cache. The cIOD packs a pleasant surprise—an iGPU based on the RDNA2 graphics architecture! Now most Ryzen 7000 processors will pack integrated graphics, just like Intel Core desktop processors.

AMD is slowly preparing to transition its consumer base into a new platform and processor architecture with the launch of Ryzen 7000 series processors codenamed Raphael. Based on the new AM5 LGA socket, these processors will come with up to 16 cores and 32 threads at the top-end configurations. Thanks to the latest round of rumors, we managed to find out just what TDP rating two SKUs will carry. According to a well-known leaker @graymon55, AMD is rating the 12-core SKU with a TDP of 105 Watts. On the other hand, the top-end 16-core 7000 series SKU replacing the current Ryzen 9 5950X will carry a large TDP of 170 Watts.

The 170 Watt TDP configuration will likely require better cooling efforts. AMD will probably advise users to invest in better cooling solutions, such as AIO liquid coolers or giant air coolers.

Here are some of the first real-world pictures of the next-generation AMD EPYC "Genoa" enterprise processors in the Socket SP5 package. The coaster-sized 6,080-pin SP5 package gives AMD's chip-designers fiberglass substrate real-estate to dial up CCD counts up to 12, resulting in up to 96 "Zen 4" CPU cores for "Genoa." Pictured below is a 16-core prototype with just two CCDs in place, as revealed by an X-ray shot. Socket SP5 gives "Genoa" some stellar I/O capabilities, including 24x 40-bit DDR5 channels (12-channel in the classical definition), and 128x PCI-Express Gen 5.0 lanes. AMD is expected to time its EPYC "Genoa" processor launch within 2022, to best compete with Intel's Xeon "Sapphire Rapids" processor launch. It will also launch a variant codenamed "Bergamo," based on "Zen 4c" CPU cores, with up to 128 cores to go around.

AMD already declared the CPU core counts of its EPYC "Genoa" and "Bergamo" processors to top out at 96 and 128, respectively, a core-count believed to have been facilitated by the larger fiberglass substrate of the next-gen SP5 CPU socket, letting AMD add more 8-core "Zen 4" chiplets, dubbed CPU complex dies (CCDs). Until now, AMD has used the chiplet as a common component between its EPYC enterprise and Ryzen desktop processors, to differentiate CPU core counts.

A fascinating theory that hit the rumor-mill, indicates that the company might leverage 5 nm (TSMC N5) carve out larger CCDs with up to 16 "Zen 4" CPU cores. Half of these cores are capped at a much lower power budget, essentially making them efficient-cores. This is a concept AMD appears to be carrying over from its 15-Watt class mobile processors, which see the CPU cores operate under an aggressive power-management. These cores still turn out a reasonable amount of performance, and are functionally identical to the ones on 105 W desktop processors with a relaxed power budget.

SiFive, Inc., the founder and leader of RISC-V computing, today announced the availability of the SiFive Performance P650 processor, the new range-topping member of the SiFive Performance family, which is expected to be the fastest licensable RISC-V processor IP core in the market. The SiFive Performance P650 will enable RISC-V designs for performance-demanding application processor markets from data center to edge, automotive, compute, mobile and more.

"SiFive's mission is to answer the semiconductor industry's call for more processor IP choices. SiFive is singularly focused on bringing innovative processor technology based on the RISC-V architecture to market," said Dr. Yunsup Lee, co-founder and CTO, SiFive. "Since the announcement of the Performance Series of RISC-V cores earlier this year, SiFive has continued to push the limits of what was previously possible with RISC-V. The SiFive Performance P650 processor IP represents our commitment towards relentless execution, delivering significant performance improvements in record time. This announcement is the next step towards our long-term vision of bringing RISC-V processors to all performance-hungry applications."

Apple has launched a host of new products, with a pair of new iPads and no less than four new iPhones and a new Apple Watch. Whether you're a fan of Apple products or not, there's no denying that the company has business acumen and delivers products that its target audience likes.

Starting with the new iPad, which is technically the least exciting product announced, we're looking at a 10.2-inch display with a resolution of 2160x1620 pixels and 264 ppi with 500 nits brightness. The iPad also features an Apple A13 SoC, an 8MP wide angle camera with a ƒ/2.4 aperture and 1080p30 video support. Maybe more importantly, at least in current times, the front facing camera has been updated to a 12MP ultra wide camera that can record video at 1080p60.

Apple today introduced an all-new iMac featuring a much more compact and remarkably thin design, enabled by the M1 chip. The new iMac offers powerful performance in a design that's just 11.5 millimeters thin, with a striking side profile that practically disappears. Available in an array of vibrant colors to match a user's personal style and brighten any space, iMac features a 24-inch 4.5K Retina display with 11.3 million pixels, 500 nits of brightness, and over a billion colors, delivering a brilliant and vivid viewing experience.

The new iMac also includes a 1080p FaceTime HD camera, studio-quality mics, and a six-speaker sound system—the best camera and audio ever in a Mac. Also, Touch ID comes to iMac for the first time, making it easier than ever to securely log in, make purchases with Apple Pay, or switch user profiles with the touch of a finger. Combining the power and performance of M1 and macOS Big Sur, apps launch with blazing speed, everyday tasks feel incredibly fast and fluid, and demanding workloads like editing 4K video and working with huge images are faster than ever. The new iMac joins the incredible family of Mac models powered by M1, including MacBook Air, 13-inch MacBook Pro, and Mac mini, marking another step forward in Apple's transition to Apple silicon. iMac is the most personal, powerful, capable, and fun it has ever been, and customers can order it beginning Friday, April 30. iMac will be available in the second half of May.