XFX over the weekend rolled out the Radeon RX 7900 XTX Phoenix Nirvana graphics card, the company's new flagship custom-design product based on fastest AMD Radeon GPU you can buy. From the looks of it, the card is China-exclusive, as we haven't seen any updates from the European or North American arms of XFX showcase this card. The Phoenix Nirvana is noticeably larger than the company's current MERC 310, and features a 4-slot design, with a significantly heavier heatsink. The card is 34.6 cm long, 13 cm tall, and is 4 slots thick.

The star attraction with this card is its large aluminium fin-stack heatsink, which features 216 aluminium fins for a total of 62.586 mm² of surface area for heat dissipation; six copper heatpipes, a vapor-chamber base, and 15,000 W/mK Honeywell PTM 7950 phase-changing thermal pad between the vapor-chamber and the GPU. Each of the three 100 mm fans of the XFX RX 7900 XTX Phoenix Nirvana features a fluid-dynamic bearing, turns at speeds of up to 3,200 RPM, pushing 70.08 CFM of airflow, at 4.88 mm H₂O, each. The card is priced at ¥7,899 in China, which converts to roughly $1,090.

AMD classified the Zenbleed vulnerability, CVE-2023-20593, as a medium-level threat about a year ago. AMD has acknowledged that it could potentially allow an attacker to access sensitive information under certain microarchitectural circumstances. Today, MSI has released new BIOS updates featuring AMD's AM4 AGESA 1.2.0.Ca firmware update. This update addresses the Zenbleed vulnerability affecting AMD's Ryzen 4000 series Zen 2 APUs. MSI is proactively rolling out the new BIOS updates across its range of compatible motherboards. The updates are currently available for almost all X570 motherboards, with support for other chipsets and 400 series motherboards expected to follow soon.

The AGESA 1.2.0.Ca firmware update specifically targets the Zenbleed vulnerability in the Zen 2 microarchitecture. Although the vulnerability primarily affects Ryzen 4000 "Renoir" APUs, it also exists in other Zen 2 processors, including the Ryzen 3000 series and certain EPYC and Threadripper CPUs. AMD has already addressed the Zenbleed vulnerability in previous AGESA microcode updates for Ryzen 3000 processors and other platforms, such as EPYC server CPUs and Ryzen mobile CPUs. However, the Ryzen Embedded V2000 CPUs are still awaiting the EmbeddedPi-FP6 1.0.0.9 AGESA firmware update, which is expected to be released by April. While AMD has not explicitly stated whether the security update will impact performance, previous testing of Zenbleed fixes has shown potential performance drops of up to 15% in certain workloads, although gaming performance remained relatively unaffected. Users with AM4 chips based on architectures other than Zen 2, such as Zen+ or Zen 3, do not need to update their BIOS as they are not affected by this specific vulnerability.

AMD's next generation RDNA 4 graphics architecture is expected to feature a completely new ray tracing engine, Kepler L2, a reliable source with GPU leaks, claims. Currently, AMD uses a component called Ray Accelerator, which performs the most compute-intensive portion of the ray intersection and testing pipeline, while AMD's approach to ray tracing on a hardware level still relies greatly on the shader engines. The company had debuted the ray accelerator with RDNA 2, its first architecture to meet DirectX 12 Ultimate specs, and improved the component with RDNA 3, by optimizing certain aspects of its ray testing, to bring about a 50% improvement in ray intersection performance over RDNA 2.

The way Kepler L2 puts it, RDNA 4 will feature a fundamentally transformed ray tracing hardware solution from the ones on RDNA 2 and RDNA 3. This could probably delegate more of the ray tracing workflow onto fixed-function hardware, unburdening the shader engines further. AMD is expected to debut RDNA 4 with its next line of discrete Radeon RX GPUs in the second half of 2024. Given the chatter about a power-packed event by AMD at Computex, with the company expected to unveil "Zen 5" CPU microarchitecture on both server and client processors; we might expect some talk on RDNA 4, too.

According to the report from BenchLife, NVIDIA has started the marketing campaign push for "Premium AI PC," squarely aimed at the industry's latest trend pushed by Intel, AMD, and Qualcomm for an "AI PC" system, which features a dedicated NPU for processing smaller models locally. NVIDIA's approach comes from a different point of view: every PC with an RTX GPU is a "Premium AI PC," which holds a lot of truth. Generally, GPUs (regardless of the manufacturer) hold more computing potential than the CPU and NPU combined. With NVIDIA's push to include Tensor cores in its GPUs, the company is preparing for next-generation software from vendors and OS providers that will harness the power of these powerful silicon pieces and embed more functionality in the PC.

At the Computex event in Taiwan, there should be more details about Premium AI PCs and general AI PCs. In its marketing materials, NVIDIA compares AI PCs to its Premium AI PCs, which have enhanced capabilities across various applications like image/video editing and upscaling, productivity, gaming, and developer applications. Another relevant selling point is the user base for these Premium AI PCs, which NVIDIA touts to be 100 million users. Those PCs support over 500 AI applications out of the box, highlighting the importance of proper software support. NVIDIA's systems are usually more powerful, with GeForce RTX GPUs reaching anywhere from 100-1300+ TOPS, compared to 40 TOPS of AI PCs. How other AI PC makers plan to fight in the AI PC era remains to be seen, but there is a high chance that this will be the spotlight of the upcoming Computex show.

SilverStone today introduced the XE360-TR5, an all-in-one liquid CPU cooler for AMD Ryzen Threadripper 7000-series processors in the Socket TR5 and SP6 packages. The cooler's design consists of a 1U-friendly waterblock, and a 360 mm radiator that integrates the pump and coolant reservoir, which is connected to the block over Nylon-sleeved tubing. The block features a nickel-plated copper main material, with metal alloy top. The cold-plate makes contact with the entire IHS of an sTR5/SP6 processor, providing cooling to all twelve CCDs and the large central sIOD. The pump integrated with the radiator is made as thin as possible using a 6-pole motor.

The 360 mm x 120 mm radiator is 28 mm-thick, and is made of aluminium, and connects to the water block over a 42 cm-long tubing. Each of the three included 120 mm fans turns at speeds ranging between 600 RPM to 2,800 RPM, pushing up to 87.72 CFM of airflow, at a radiator-friendly 3.09 mm H₂O static pressure, and 46 dBA maximum noise output. The company didn't reveal pricing.

AMD is now a 55-year-old company. The chipmaker was founded on May Day, 1969, and traversed practically every era of digital computing to reach where it is today—a company that makes contemporary processors for PCs, servers, and consumer electronics; GPUs for gaming graphics, professional visualization, and the all important AI HPC processors that are driving the latest era of computing. As of this writing, AMD has a market capitalization of over $237 billion, presence in all market regions, and supplies hardware and services to nearly every Fortune 500 company, including every IT giant. Happy birthday, AMD!

Micron Technology, Inc. (Nasdaq: MU), today announced it is leading the industry by validating and shipping its high-capacity monolithic 32Gb DRAM die-based 128 GB DDR5 RDIMM memory in speeds up to 5,600 MT/s on all leading server platforms. Powered by Micron's industry-leading 1β (1-beta) technology, the 128 GB DDR5 RDIMM memory delivers more than 45% improved bit density, up to 22% improved energy efficiency and up to 16% lower latency over competitive 3DS through-silicon via (TSV) products.

Micron's collaboration with industry leaders and customers has yielded broad adoption of these new high-performance, large-capacity modules across high-volume server CPUs. These high-speed memory modules were engineered to meet the performance needs of a wide range of mission-critical applications in data centers, including artificial intelligence (AI) and machine learning (ML), high-performance computing (HPC), in-memory databases (IMDBs) and efficient processing for multithreaded, multicore count general compute workloads. Micron's 128 GB DDR5 RDIMM memory will be supported by a robust ecosystem including AMD, Hewlett Packard Enterprise (HPE), Intel, Supermicro, along with many others.

TPV USA, the brand license partner for Philips monitors is launching its flagship model to the EVNIA Gaming lineup with Philips Evnia 49M2C8900 49" QD OLED Curved Gaming Monitor, setting a new standard for gaming monitors with its innovative technology and immersive features. Dedicated to bringing the joy of gaming to all players, from casual enthusiasts to hardcore pros, the Philips Evnia 49M2C8900 redefines what it means to game.

"The Philips Evnia 49M2C8900 brings a new level of immersion and innovation to gaming, providing a captivating experience for gamers of all levels. With its exceptional design and advanced technology, this monitor is a standout addition to our product lineup," says James Melendez, CEO and President at TPV USA (Philips).

AMD (NASDAQ:AMD) today announced revenue for the first quarter of 2024 of $5.5 billion, gross margin of 47%, operating income of $36 million, net income of $123 million and diluted earnings per share of $0.07. On a non-GAAP basis, gross margin was 52%, operating income was $1.1 billion, net income was $1.0 billion and diluted earnings per share was $0.62.

"We delivered strong first quarter results with our Data Center and Client segments each growing more than 80% year-over-year driven by the ramp of MI300 AI accelerator shipments and the adoption of our Ryzen and EPYC processors," said AMD Chair and CEO Dr. Lisa Su. "This is an incredibly exciting time for the industry as widespread deployment of AI is driving demand for significantly more compute across a broad range of markets. We are executing very well as we ramp our data center business and enable AI capabilities across our product portfolio."

AMD Ryzen 9 7900X3D, the 12-core/24-thread Socket AM5 processor with 3D V-cache, is selling at a new low price of just $329. A retailer-specific discount by AntOnline puts the processor at a price lower than the launch price of the Ryzen 7 7700X, and Core i5-14600K. While we haven't had a chance to test this chip, testing by Tom's Hardware puts its gaming performance higher than the Core i9-13900K, with a multithreaded productivity performance in a similar range. The 7900X3D probably suffers from bad sales due to the popularity of the Ryzen 7 7800X3D, which remains the fastest gaming processor, and the 7950X3D, which is AMD's flagship processor.

That's not all, prices of even some of the recently launched processors for the older Socket AM4 platform are on a slope, which could attract sales from those that want to upgrade. The Ryzen 7 5700X3D is a slightly slower version of the 5800X3D—the fastest gaming processor for AM4, with a gaming performance rivaling the Core i9-12900K. This new chip can be had at just $229 on Amazon US. The Ryzen 7 5800X was once a solid gaming processor when AMD dominated Intel's 10th- and 11th Gen, it's now going for just $179.

AMD has released the latest version of Adrenalin Edition graphics drivers, version 24.4.1 WHQL. It includes support for the upcoming Manor Lords game, as well as add performance improvements for HELLDIVERS 2 game, and adds AMD HYPR-Tune support to Nightingale and SKULL AND BONES games. New drivers also expand Vulkan API extensions support with VK_KHR_shader_maximal_reconvergence and VK_KHR_dynamic_rendering_local_read, as well as include support and optimizations for Topaz Gigapixel AI application, versions 7.1.0 and 7.1.1, with new "Recovery" and "Low Resolution" AI upscaling features.

New AMD Software Adrenalin Edition 24.4.1 WHQL drivers come with several fixes, including performance improvements for HELLDIVERS 2, fix for intermittent application crash in Lords of the Fallen on Radeon RX 6000 series graphics cards, various artifact issues in SnowRunner and Horizon Forbidden West Complete Edition on Radeon RX 6800 and Radeon RX 6000 series graphics cards, fix for intermittent application crash or driver timeout in Overwatch 2 when Radeon Boost is enabled on Radeon RX 6000 and above series graphics cards, intermittent crash while changing Anti-Aliasing settings in Enshrouded on Radeon 7000 series graphics cards, and various application freeze or crash issues with the SteamVR while using Quest Link on Meta Quest 2 or when screen sharing with Microsoft Teams.

DOWNLOAD: AMD Software Adrenalin 24.4.1 WHQL

ASRock Technology, a global leader in motherboard manufacturing, today announced the release of the latest AGESA beta BIOS for AM5 motherboards, enabling support for next-generation Ryzen processors. ASRock AM5 motherboard lineup can now support next-generation AMD Ryzen processors with the installation of the latest new AGESA 1.1.7.0 beta BIOS, significantly improving processor compatibility and providing users of ASRock AM5 motherboards with enhanced Ryzen processor support.

Users can easily update to the latest AGESA 1.1.7.0 beta BIOS through ASRock official website or using features like BIOS Flashback and Instant Flash. ASRock recommends that users update to the latest BIOS version as soon as possible to achieve better compatibility and system performance. The official version is expected to be released later, so please stay tuned to the ASRock official website for the latest updates.

AMD's next-generation Ryzen 9000 "Strix Point" mobile processor, which succeeds the current Ryzen 8040 "Hawk Point" and Ryzen 7040 "Phoenix," is confirmed to feature a CPU core-configuration of 12-core/24-thread, according to a specs-leak by HKEPC citing sources among notebook OEMs. It appears like Computex 2024 will be big for AMD, with the company preparing next-gen processor announcements across the desktop and notebook lines. Both the "Strix Point" mobile processor and "Granite Ridge" desktop processor debut the company's next "Zen 5" microarchitecture.

Perhaps the biggest takeaway from "Zen 5" is that AMD has increased the number of CPU cores per CCX from 8 in "Zen 3" and "Zen 4," to 12 in "Zen 5." While this doesn't affect the core-counts of its CCD chiplets (which are still expected to be 8-core), the "Strix Point" processor appears to use one giant CCX with 12 cores. Each of the "Zen 5" cores has a 1 MB dedicated L2 cache, while the 12 cores share a 24 MB L3 cache. The 12-core/24-thread CPU, besides the generational IPC gains introduced by "Zen 5," marks a 50% increase in CPU muscle over "Hawk Point." It's not just the CPU complex, even the iGPU sees a hardware update.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, today is excited to announce a brand-new BIOS update designed for its AMD AM5 series motherboards, incorporating the latest AGESA PI 1.1.7.0 Patch A architecture. This update is aimed at the imminent release of AMD's next-generation CPUs, ensuring that BIOSTAR motherboards are primed to unleash the full potential of these cutting-edge processors. With a strong focus on future-ready performance, this BIOS update will be available to download soon and is ready to redefine computing power and performance with the latest AMD processors. BIOSTAR invites users to stay tuned to its official website for the BIOS release and future updates.

AMD is readying a new line of EPYC branded server processors in the Socket AM5 package, VideoCardz reports. The new processor lineup is being built to target two distinct classes of customers—small business servers, and data-centers selling small-size dedicated servers that were otherwise having to offer Ryzen chips. Intel currently has the Xeon E-2400 series "Raptor Lake-E" processors in the Socket LGA1700 package to target these exact kinds of customers. The EPYC 4004 series will be based on the same "Raphael" package as the Ryzen 7000 series, and will be a step up from the Ryzen PRO 7000 series. What sets the Ryzen PRO 7000 apart from the EPYC 4004 series are the target markets. The Ryzen PRO series target commercial desktops. Perhaps the biggest differentiator between EPYC 4004 and Ryzen PRO 7000 series is the support and warranty AMD provides to its server processors.

The "Raphael" package gives the EPYC 4004 series CPU core counts ranging between 6 and 16. These CPU cores are based on the "Zen 4" microarchitecture. The memory controllers in the I/O die will probably be reconfigured to support server memory densities, besides ECC support like on the Ryzen PRO 7000 series. There's even talk of variants with 3D V-cache, although it remains to be seen if the 12-core and 16-core variants are similar to the 7900X3D and 7950X3D, where only one of the two CCDs has 3D V-cache; or if they're the chip we all dreamed about—a "Raphael" with both CCDs featuring 3D V-cache. There are already Socket AM5 motherboards by companies such as Advantech, which are server-grade, with server-relevant I/O, like the one pictured below, and so the ecosystem for EPYC 4004 series already exists, along with upgrade headroom for future generations.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, released the latest AGESA 1.1.7.0 beta bios for the coming AMD Ryzen 9000 series processors boot-up support on GIGABYTE AM5 X670, B650, A620 motherboards, and for present Ryzen 7000 and 8000 series processors as well.⁠ The AGESA 1.1.7.0 beta BIOS is now ready on the GIGABYTE official website, and the formal release will be in mid-May. Users can easily update the BIOS using GIGABYTE's ＠BIOS, Q-Flash, or Q-Flash Plus technology. For more update, please pay close attention to the official GIGABYTE website.

AMD is reportedly planning to launch the Ryzen 7 8700F and Ryzen 5 8400F Socket AM5 desktop processors for a global launch, in the retail channel, as boxed processors. The two chips had launched earlier this month in the Chinese retail market. The 8700F reportedly comes with an OPN of 100-100001590BOX, while the 8400F is marked 100-100001591BOX. The "F" in both SKUs denotes a lack of integrated graphics. The Ryzen 7 8700F is an 8-core/16-thread processor based on the 4 nm "Hawk Point" silicon, while the 8400F is a 6-core/12-thread processor based on "Phoenix 2," which offers two "Zen 4" cores that run at higher clock speeds, and four "Zen 4c" cores that run at lower speeds.

The lack of an iGPU isn't the only thing differentiating the 8700F from the 8700G, the new chip even comes with slightly lower CPU clock speeds—100 MHz lower base and maximum boost frequencies. The 8700F CPU runs at a base frequency of 4.10 GHz, with 5.00 GHz maximum boost, when compared to the 4.20/5.10 GHz speeds of the 8700G. The 8400F, on the other hand, runs at 4.20 GHz base frequency, and a 4.70 GHz maximum boost frequency that applies to at least its two "Zen 4" cores; its four "Zen 4c" cores run at lower frequencies. There is no word on pricing. One reason you could want an 8700F over something like a 7700 would be its appetite for memory overclocking, if you can overlook the lack of integrated graphics, a smaller L3 cache, and most importantly, the lack of PCIe Gen 5, and four fewer PCIe lanes.

Today, we have the latest round of leaks that suggest that AMD's upcoming RDNA 4 graphics cards, codenamed the "RX 8000-series," might continue to rely on GDDR6 memory modules. According to Kepler on X, the next-generation GPUs from AMD are expected to feature 18 Gbps GDDR6 memory, marking the fourth consecutive RDNA architecture to employ this memory standard. While GDDR6 may not offer the same bandwidth capabilities as the newer GDDR7 standard, this decision does not necessarily imply that RDNA 4 GPUs will be slow performers. AMD's choice to stick with GDDR6 is likely driven by factors such as meeting specific memory bandwidth requirements and cost optimization for PCB designs. However, if the rumor of 18 Gbps GDDR6 memory proves accurate, it would represent a slight step back from the 18-20 Gbps GDDR6 memory used in AMD's current RDNA 3 offerings, such as the RX 7900 XT and RX 7900 XTX GPUs.

AMD's first generation RDNA used GDDR6 with 12-14 Gbps speeds, RDNA 2 came with GDDR6 at 14-18 Gbps, and the current RDNA 3 used 18-20 Gbps GDDR6. Without an increment in memory generation, speeds should stay the same at 18 Gbps. However, it is crucial to remember that leaks should be treated with skepticism, as AMD's final memory choices for RDNA 4 could change before the official launch. The decision to use GDDR6 versus GDDR7 could have significant implications in the upcoming battle between AMD, NVIDIA, and Intel's next-generation GPU architectures. If AMD indeed opts for GDDR6 while NVIDIA pivots to GDDR7 for its "Blackwell" GPUs, it could create a disparity in memory bandwidth performance between the competing products. All three major GPU manufacturers—AMD, NVIDIA, and Intel with its "Battlemage" architecture—are expected to unveil their next-generation offerings in the fall of this year. As we approach these highly anticipated releases, more concrete details on specifications and performance capabilities will emerge, providing a clearer picture of the competitive landscape.

Korean media reports that Samsung Electronics has signed a 4.134 trillion Won ($3 billion) agreement with AMD to supply 12-high HBM3E stacks. AMD uses HBM stacks in its AI and HPC accelerators based on its CDNA architecture. This deal is significant, as it gives analysts some idea of the kind of volumes of AI GPUs AMD is preparing to push into the market, if they know what percent of an AI GPU's bill of materials is made up by memory stacks. AMD has probably negotiated a good price for Samsung's HBM3E 12H stacks, given that rival NVIDIA almost exclusively uses HBM3E made by SK Hynix.

The AI GPU market is expected to heat up with the ramp of NVIDIA's "Hopper" H200 series, the advent of "Blackwell," AMD's MI350X CDNA3, and Intel's Gaudi 3 generative AI accelerator. Samsung debuted its HBM3E 12H memory in February 2024. Each stack features 12 layers, a 50% increase over the first generation of HBM3E, and offers a density of 36 GB per stack. An AMD CDNA3 chip with 8 such stacks would have 288 GB of memory on package. AMD is expected to launch the MI350X in the second half of 2024. The star attraction with this chip is its refreshed GPU tiles built on the TSMC 4 nm EUV foundry node. This seems like the ideal product for AMD to debut HBM3E 12H on.

Velocity Micro, the premier builder of award-winning enthusiast desktops, laptops, high performance computing solutions, and professional workstations announces the immediate availability of a line of Linux powered PCs preinstalled with Ubuntu 22.04. Systems are designed for a wide range of customers and use cases such as individual enthusiasts, CAD and content creation professionals, machine learning/AI, and enterprise, to bring the flexibility and security of an open source OS platform into the mainstream. Desktops start at $1,429 with Linux laptops starting at $1,199. Shipments begin immediately.

"We've been preinstalling various flavors of Linux on custom server and workstation builds for years, which has really afforded us the opportunity to get hands-on to learn the OS," said Randy Copeland, President and CEO of Velocity Micro. "We're excited to bring what we've learned to market and introduce our customers to Ubuntu Linux."

Enthusiasts on the ChipHell forum scored an alleged image of AMD's upcoming "Strix Halo" mobile processor, and set out to create some highly plausible schematic slides. These are speculative. While "Strix Point" is the mobile processor that succeeds the current "Hawk Point" and "Phoenix" processors; "Strix Halo" is in a category of its own—to offer gaming experiences comparable to discrete GPUs in the ultraportable form-factor where powerful discrete GPUs are generally not possible. "Strix Halo" also goes head on against Apple's M3 Max and M3 Pro processors powering the latest crop of MacBook Pros. It has the same advantages as a single-chip solution, as the M3 Max.

The "Strix Halo" silicon is a chiplet-based processor, although very different from "Fire Range". The "Fire Range" processor is essentially a BGA version of the desktop "Granite Ridge" processor—it's the same combination of one or two "Zen 5" CCDs that talk to a client I/O die, and is meant for performance-thru-enthusiast segment notebooks. "Strix Halo," on the other hand, use the same one or two "Zen 5" CCDs, but with a large SoC die featuring an oversized iGPU, and 256-bit LPDDR5X memory controllers not found on the cIOD. This is key to what AMD is trying to achieve—CPU and graphics performance in the league of the M3 Pro and M3 Max at comparable PCB and power footprints.

Nixxes Software has released official PC system requirements for Ghost of Tsushima: Director's Cut that will officially launch on May 16th. In addition, the game will be the first PlayStation title on PC that will use the PlayStation overlay. The game will also feature support for NVIDIA DLSS 3, AMD FSR 3 and Intel XeSS, as well as support for NVIDIA DLAA and AMD FSR 3 Native AA.

Ghost of Tsushima: Director's Cut on PC will feature the full game, the Iki Island expansion, and the cooperative online multiplayer Legends mode. It will also support cross-play, allowing games on PC to team up with PlayStation 4 and PlayStation 5 consoles. Of course, you'll still need to sign in to PlayStation Network account for Legends mode. In addition, this will be the first game on the PC to use the new PlayStation overlay, allowing users on PC to access Friends list, Trophies, Settings, and Profile.

Lenovo is putting finishing touches on the Yoga Slim 7 14 2024, one of the first non-reference laptop to feature Qualcomm's latest Snapdragon X processor. Leaked images circulating on X (formerly Twitter) reveal a sleek and stylish design, with a 14-inch or 14.5-inch display encased in a slim and portable form factor. Qualcomm has previously showcased eye-catching demo reference systems in a striking red color scheme, but Lenovo's Yoga Slim 7 14 2024 marks the first time a significant laptop manufacturer with actual product images incorporating the Snapdragon X chip. The Yoga Slim 7 14 2024 is part of Lenovo's popular Slim laptop lineup, including models powered by Intel and AMD processors. The latest "Gen 8" iteration featured options for AMD Ryzen 7040 series and Intel 13th Gen Core i and Core Ultra series CPUs.

One notable addition to the Snapdragon X-powered model is the inclusion of a dedicated Microsoft Copilot button. Qualcomm has heavily touted the Snapdragon X's Neural Processing Unit (NPU) performance and its ability to directly accelerate various AI and machine learning algorithms on the device. There have been a few comparison points between Meteor Lake with Intel's NPU and Snapdragon X Elite with Qualcomm's NPU. The chipmaker's X Elite and X Plus laptop offerings are expected to arrive soon, and there are strong indications that this may happen during the Computex trade show.Update 17:28 UTC: X user WalkingCat has posted images of Lenovo Thinkpad T14s laptop, which can be seen below.

MSI is here to announce the latest AGESA ComboPI 1.1.7.0 Patch A BIOS update for AM5 next gen CPU support on X670E, X670, B650, A620 motherboards. Users would simply need to update the BIOS to the latest version accordingly. MSI will continue to update the latest news for our users. Please follow MSI's official channels and check the product pages for the latest BIOS updates to guarantee optimal experience, heightened performance, and enhanced stability.

For more about MSI AMD 600 series motherboards, please check here.

Today, AMD announced new products that will expand its commercial mobile and desktop AI PC portfolio, delivering exceptional productivity and premium AI and connectivity experiences to business users. The new AMD Ryzen PRO 8040 Series are the most advanced x86 processors built for business laptops and mobile workstations. In addition, AMD also announced the AMD Ryzen PRO 8000 Series desktop processor, the first AI enabled desktop processor for business users, engineered to deliver cutting-edge performance with low power consumption.

With AMD Ryzen AI built into select models, AMD is further extending its AI PC leadership. By leveraging the CPU, GPU, and dedicated on-chip neural processing unit (NPU), new Ryzen AI-powered processors provide more dedicated AI processing power than previous generations, with up to 16 dedicated NPU TOPS (Trillions of Operations Per Second) and up to 39 total system TOPS. Commercial PCs equipped with new Ryzen AI-enabled processors will help transform user experience, offering next-gen performance for AI-enabled collaboration, content creation, and data and analytics workloads. With the addition of AMD PRO technologies, IT managers can unlock enterprise-grade manageability features to simplify IT operations and complete PC deployment faster across the organization, built-in security features for chip-to-cloud defense from sophisticated attacks, as well as unprecedented stability, reliability and platform longevity for enterprise software.